2026年11月4日星期三
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消息称部分半导体设备制造商已启动 2029 年供应谈判

出典 IT之家6 時間前
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This item is a 中文-language original; headline and summary shown as published.

IT之家 11 月 4 日消息，韩媒 ETNEWS 当地时间昨日报道称，全球五大半导体设备制造商（ASML、Applied Materials、Lam Research、TEL、KLA）已进入 2028 年设备供应合同的最终敲定阶段。 人工智能的快速发展带来了庞大的芯片产能需求，这意味着芯片制造商需要扩充产能，半导体…

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中国
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消息称部分半导体设备制造商已启动 2029 年供应谈判 · 寰宇通鑑