2026年11月4日星期三
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三星电子会长李在镕赴日本考察先进封装技术，计划 5 年投资 400 亿日元

ប្រភព IT之家2 ថ្ងៃមុន
Summary

This item is a 中文-language original; headline and summary shown as published.

IT之家 11 月 1 日消息，三星电子会长李在镕今日访问位于日本横滨的先进封装研究中心（APL），实地考察下一代半导体封装材料及工艺技术研发进展，并与当地研究人员讨论加强与日本半导体材料、零部件及设备企业的合作。 据悉，三星电子计划自 2024 年起在未来 5 年投资 400 亿日元 （IT之家注：现汇率约合 16…

យើងផ្តល់តែសន្ទស្សន៍ចំណងជើង និងសេចក្តីសង្ខេប។ ខ្លឹមសារពេញលេញ និងសិទ្ធិអ្នកនិពន្ធ ជាកម្មសិទ្ធិរបស់ប្រភពដើម — សូមចុចតំណដើមដើម្បីអាន។

បើកឯកសារដើម
ផ្នែកព័ត៌មាន
Tech
តំបន់
China
Language
中文
Item ID
tech-f816549b

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三星电子会长李在镕赴日本考察先进封装技术，计划 5 年投资 400 亿日元 · Meridian Globe